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Copper Metal Foam
Minimum Order Quantity: 5 Piece
Product Brochure
Thickness | 2mm |
Density | 8.96g/cm3 |
Material | Copper Foam |
Size | 500x500mm |
Brand | Nanoshel |
Product Code | NS6130-10-1007 |
Stock no | NS6130-10-1007 |
PPI | 50 |
Molecular Formula | Cu |
Pore Size | 1mm (50ppi) |
Melting Point | 1085 Degree C |
Purity | 99.9% |
Tensile Strength | 1.25N/mm |
Boiling Point | 2562 Degree C |
Porosity | 70% |
Molecular Weight | 63.55g/mol |
Electronegativity | 1.90paulings |
Shear Strength | 190Psi |
Backed by our rich industrial expertise, we have come up with Innovative Materials for our valuable customers. Formulated under hygienic conditions and thoroughly tested, this is highly regarded in the market. It finds application as catalysts, energy conserving coatings, anti-static coatings, etc. It is a white colored powder of optimum purity. We offer Innovative Materials at standard market prices By Nanoshel.
Product |
Copper Foam ( 50PPI/2mm) |
PPI |
50 |
Bulk Density |
0.80-0.85 g/cc |
Purity |
≥99.8% |
Porosity |
≥70% |
Dimension |
500mm X 500mm |
Thickness |
2mm |
Physical Characteristics Copper Foam as battery electrode materials
Compression Strength |
131 psi |
Tensile Strength |
1000 psi |
Shear Strength |
190 psi |
Modulus of Elasticity (Compression) |
107 kpsi |
Modulus of Elasticity (Tension) |
14.6 × 103 psi |
Shear Modulus |
40.9 kpsi |
Vickers Hardness |
35 |
Specific Heat |
0.385 J/g-°C |
Bulk Thermal Conductivity |
10.1 W/m-°C |
Coefficient of Thermal Expansion |
1.7 × 10-5 m/m–°C (0-100°C) |
Bulk Resistivity |
2.56× 10-5 ohm – in |
Melting Point |
1080°C |
Features:
- Formulated under hygienic conditions
- Quality tested
- High purity
Product Description:
Stock No: 6130-10-1007 |
Copper Foam(Purity: ≥99.8%, 50PPI/2mm) |
Additional Information:
- Item Code: NS6130-10-1007
- Pay Mode Terms: L/C (Letter of Credit),T/T (Bank Transfer)
- Port of Dispatch: Delhi
- Production Capacity: 100 Nos
- Delivery Time: 4Weeks
- Packaging Details: As per customer requirement